DAMO: Deep Agile Mask Optimization for Full-Chip Scale
DAMO: Deep Agile Mask Optimization for Full-Chip Scale
Continuous scaling of the very-large-scale integration system leaves a significant challenge on manufacturing; thus optical proximity correction (OPC) is widely applied in conventional design flow for manufacturability optimization. Traditional techniques conduct OPC by leveraging a lithography model but may suffer from prohibitive computational overhead. In addition, most of them focus …