Wirebond crosstalk and cavity modes in large chip mounts for superconducting qubits
Wirebond crosstalk and cavity modes in large chip mounts for superconducting qubits
We analyze the performance of a microwave chip mount that uses wirebonds to connect the chip and mount grounds. A simple impedance ladder model predicts that transmission crosstalk between two feedlines falls off exponentially with distance at low frequencies, but rises to near unity above a resonance frequency set by …