Extensible 3D architecture for superconducting quantum computing
Extensible 3D architecture for superconducting quantum computing
Using a multi-layered printed circuit board, we propose a 3D architecture suitable for packaging superconducting chips, especially chips that contain two-dimensional qubit arrays. In our proposed architecture, the center strips of the buried coplanar waveguides protrude from the surface of a dielectric layer as contacts. Since the contacts extend beyond …