Thermocompression bonding technology for multilayer superconducting quantum circuits
Thermocompression bonding technology for multilayer superconducting quantum circuits
Extensible quantum computing architectures require a large array of quantum bits operating with low error rates. A quantum processor based on superconducting devices can be scaled up by stacking microchips that perform wiring, shielding, and computational functionalities. In this article, we demonstrate a vacuum thermocompression bonding technology that utilizes thin …