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Electrodeposition and Electroless Coatings

Works Count: 35909

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Description

This cluster of papers covers various aspects of electrodeposition, including the incorporation of nanoparticles, pulse and pulse reverse plating, electroless nickel coatings, tribological properties, metal matrix composite coatings, and corrosion resistance. It also explores topics such as superconformal electrodeposition, additive manufacturing, and the use of nanomaterials in composite coatings.

Keywords

Electrodeposition; Composite Coatings; Nanoparticles; Pulse Plating; Electroless Nickel; Nanostructured Coatings; Tribology; Metal Matrix Composites; Corrosion Resistance; Additive Manufacturing

Fundamentals of electrochemical deposition

2007-02-01

Milan Paunović , Mordechay Schlesinger

Preface to the Second Edition. Preface to the First Edition. 1. Overview. 2. Water and Ionic Solutions. 3. Metals and Metal Sufaces. 4. Metal-Solution Interphase. 5. Equilibrium Electrode Potential. 6. … Preface to the Second Edition. Preface to the First Edition. 1. Overview. 2. Water and Ionic Solutions. 3. Metals and Metal Sufaces. 4. Metal-Solution Interphase. 5. Equilibrium Electrode Potential. 6. Kinetics and Mechanism of Electrodeposition. 7. Nucleation and Growth Models. 8. Electroless Deposition. 9. Displacement Deposition. 10. Effect of Additives. 11. Electrodeposition of Alloys. 12. Metal Deposit and Current Distribution. 13. Characterization of metallic Surfaces and Thin Films. 14. In Situ Characterization of Deposition. 15. Mathematical Modeling in Electrochemistry. 16. Structure anad Properties of Deposits. 17. Electrodeposited Multilayers. 18. Interdiffusion in Thin Films. 19. Applications in Semiconductors Technology. 20. Applications in the Fields of Magnetism and Microelectronics. 21. Frontiers in Applications: Applications in the Field of Medicine. Index.

Copper Foam Structures with Highly Porous Nanostructured Walls

2004-11-17

Heon‐Cheol Shin , Meilin Liu

A variety of copper foams with highly open porous walls have been successfully sculptured using the gas evolved in an electrochemical deposition process. The pore sizes and wall structures of … A variety of copper foams with highly open porous walls have been successfully sculptured using the gas evolved in an electrochemical deposition process. The pore sizes and wall structures of the foams are tunable by adjusting the deposition conditions. In particular, the reduction in pore size is a result of lowering hydrophobic force of the generated hydrogen gas by adding bubble stabilizer (e.g., acetic acid) that suppresses the coalescence of bubbles, while the decrease in branch size in the foam wall is a consequence of the catalytic effect of chloride ions (added to the deposition bath) on the copper deposition reaction. For example, the size of the surface pore of a 100-μm-thick foam was reduced from 50 to about 25 μm by adding 0.1 M acetic acid to the deposition bath. With the addition of 1−50 mM HCl, the size of the copper branches was dramatically reduced; in particular, the average size of the elementary branches in the foam wall was reduced from 300 to 50 nm, forming nanostructured porous electrodes ideally suited for electrochemical and catalytic applications.

Electrodeposition and sliding wear resistance of nickel composite coatings containing micron and submicron SiC particles

2001-12-01

I. Garcı́a , Jan Fransaer , J.‐P. Celis

Effect of nanocrystalline grain size on the electrochemical and corrosion behavior of nickel

2004-07-07

Rajiv S. Mishra , R. Balasubramaniam

Electrodeposition of Alloys

1964-01-01

Abner Brenner , S. Senderoff

Electrochemical codeposition of inert particles in a metallic matrix

1995-06-01

A. Hovestad , L.J.J. Janssen

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Superconformal film growth: Mechanism and quantification

2005-01-01

T. P. Moffat , Daniel Wheeler , Monica D. Edelstein +1 more

Superconformal electrodeposition of copper is explained by the recently developed curvature-enhanced-accelerator coverage (CEAC) model, which is based on the assumptions that 1) the local growth velocity is proportional to the … Superconformal electrodeposition of copper is explained by the recently developed curvature-enhanced-accelerator coverage (CEAC) model, which is based on the assumptions that 1) the local growth velocity is proportional to the surface coverage of the accelerator, or catalyst, and 2) the catalyst remains segregated at the metal/electrolyte interface during copper deposition. For growth on nonplanar geometries, this leads to enrichment of the catalyst on advancing concave surfaces and dilution on advancing convex sections, thereby giving rise to bottom-up superfilling of submicrometer trenches and vias. In this paper the robustness of the CEAC model is demonstrated by characterizing the kinetics of catalyst accumulation and consumption in a series of electroanalytical experiments on planar electrodes. The model is then used to successfully predict interface shape evolution during feature filling in a variety of experiments, without using adjustable parameters.

Electrodeposited nanocrystals: Synthesis, properties and industrial applications

1995-01-01

U. Erb

Fundamental aspects of electropolishing

1987-01-01

D. Landolt

Mechanical properties and wear and corrosion resistance of electrodeposited Ni–Co/SiC nanocomposite coating

2005-06-22

Lei Shi , Chufeng Sun , Ping Gao +2 more

Electrodeposition of Ni–SiC nano-composite coatings and evaluation of wear and corrosion resistance and electroplating characteristics

2007-08-03

Mohammad Reza Vaezi , S.K. Sadrnezhaad , Leila Nikzad

Superconformal Electrodeposition of Copper in 500–90 nm Features

2000-01-01

Thomas P. Moffat , John E. Bonevich , William Huber +4 more

Superconformal electrodeposition of copper in 500 nm deep trenches ranging from 500 to 90 nm in width has been demonstrated using an acid cupric sulfate electrolyte containing chloride (Cl), polyethylene … Superconformal electrodeposition of copper in 500 nm deep trenches ranging from 500 to 90 nm in width has been demonstrated using an acid cupric sulfate electrolyte containing chloride (Cl), polyethylene glycol (PEG), and 3‐mercapto‐l‐propanesulfonate (MPSA). In contrast, similar experiments using either an additive‐free electrolyte, or an electrolyte containing the binary combinations Cl‐PEG, Cl‐MPSA, or simply benzotriazole (BTAH), resulted in the formation of a continuous void within the center of the trench. Void formation in the latter electrolytes is shown to be reduced through the geometrical leveling effect associated with conformal deposition in trenches or vias with sloping sidewalls. The slanted sidewalls also counterbalance the influence of the differential cupric ion concentration that develops within the trenches. Examination of the i-E deposition characteristics of the electrolytes reveals a hysteretic response associated with the Cl‐PEG‐MPSA electrolyte that can be usefully employed to monitor and explore additive efficacy and consumption. Likewise, resistivity measurements performed on corresponding blanket films can be used to quantify the extent of additive incorporation and its influence on microstructural evolution. The films deposited from the Cl‐PEG‐MPSA electrolyte exhibit spontaneous recrystallization at room temperature that results in a 23% drop in resistivity within a few hours of deposition. © 2000 The Electrochemical Society. All rights reserved.

Some theoretical aspects of pulse electrolysis

1980-02-01

N. Ibl

Pulse and pulse reverse plating—Conceptual, advantages and applications

2007-12-05

Chandrasekar M. Subramaniyam , Malathy Pushpavanam

Electroless nickel, alloy, composite and nano coatings – A critical review

2013-03-27

J. Sudagar , Jianshe Lian , Wei Sha

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Electrochemical deposition of metals onto silicon

1998-08-21

Gerko Oskam , John G. Long , Arun Natarajan +1 more

The general concepts governing the electrochemical deposition of metal films onto semiconductors are discussed. Deposition onto semiconductor surfaces is complicated due to the band structure of the semiconductor, which affects … The general concepts governing the electrochemical deposition of metal films onto semiconductors are discussed. Deposition onto semiconductor surfaces is complicated due to the band structure of the semiconductor, which affects both the thermodynamics and the kinetics of metal deposition processes. The influence of the potential distribution at the semiconductor/solution interface on the charge transfer mechanisms involved in deposition of metals is discussed. Models for electrochemical nucleation and growth are described and the influence of the unique physical properties of semiconductors is analysed. Finally, we present recent results for electrochemical deposition of gold, copper and platinum onto n-type silicon.

A Mathematical Model for the Electrolytic Codeposition of Particles with a Metallic Matrix

1987-06-01

Jean‐Pierre Célis , J.R. Roos , C Buelens

Over the last decade the general knowledge of the electrolytic codeposition of inert particles with metals has increased markedly, and a few models have been proposed. In this paper a … Over the last decade the general knowledge of the electrolytic codeposition of inert particles with metals has increased markedly, and a few models have been proposed. In this paper a new model that overcomes several of the shortcomings of the previously proposed models is developed starting from a statistical approach of the incorporation of particles. The validity of the new model is shown for two experimental codeposition systems, namely, from acidic sulfate baths and from additive‐free potassium cyanide baths.

Synthesis of bulk nanocrystalline nickel by pulsed electrodeposition

1995-11-01

A.M. El-Sherik , U. Erb

Electroless alloy/composite coatings: A review

2003-06-01

R. C. Agarwala , Vijaya Agarwala

Tribology of electroless nickel coatings – A review

2010-11-12

Prasanta Sahoo , Suman Kalyan Das

Fundamental aspects and applications of electrochemical microfabrication

2000-05-01

Madhav Datta , D. Landolt

The chemistry of additives in damascene copper plating

2005-01-01

Philippe M. Vereecken , Robert A. Binstead , Hariklia Deligianni +1 more

Copper plating baths used for forming integrated circuit interconnects typically contain three or four component additive mixtures which facilitate the superfilling of via holes and trench lines during damascene plating. … Copper plating baths used for forming integrated circuit interconnects typically contain three or four component additive mixtures which facilitate the superfilling of via holes and trench lines during damascene plating. Extensive study over the last two decades has provided researchers with an understanding of the underlying mechanisms. The role of cuprous intermediates in the copper deposition reaction has long been acknowledged, but it is not yet fully understood. In this paper we describe the results of an electrochemical study of the interaction of the organic additives used with copper and copper ions in solution. It is shown that cuprous intermediates near the copper surface affect the overpotential and the kinetics of plating. The additives regulate the presence of cuprous species on the surface; levelers and suppressors inhibit Cu + formation, whereas accelerating additives enhance Cu + formation. Acceleration by the bis(sodiumsulfopropyl) disulfide (SPS) additive results from accumulation of cuprous complexes near the surface. Adsorbed cuprous thiolate [Cu(I)(S(CH <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> ) <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> SO <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> H) <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ad</inf> ] is formed through interaction of Cu + ions and SPS rather than Cu 2+ and mercaptopropane sulfonic acid (MPS).

Direct observations of defects in quenched gold

1959-01-01

J. Silcox , P. B. Hirsch

Abstract An electron microscope transmission study has been made of thin foils of gold produced by electro-polishing from quenched gold specimens. Thin gold sheet was quenched from a vertical tube … Abstract An electron microscope transmission study has been made of thin foils of gold produced by electro-polishing from quenched gold specimens. Thin gold sheet was quenched from a vertical tube furnace at 910°c to 960°c into iced brine. Subsequent ageing treatment was carried out, for example for an hour at 100°c. Contrast effects were observed of geometrical shapes with sides parallel to [110] projections in the plane of the foil. Analysis of the shapes of the contrast in two different orientations shows that they arise from tetrahedra of stacking faults on (111) planes with 1/6[110] type stair-rod dislocations along the edges of the tetrahedron. A reaction is pointed out whereby the defect may arise from an equilateral triangle, with [110] edges, of stacking fault surrounded by a Frank sessile dislocation on a (111) plane. On the assumption that the triangles were formed by the disc-like condensation of vacancies, the size of the defects, about 360 Å, and the density, about 5 × 1014 cm−s, correspond to an initial vacancy concentration of 6 × 10−5. The interaction of dislocations with the defects confirms the hypothesis of stacking fault tetrahedra. Finally the formation of the defects and their influence upon the physical properties of the crystal are discussed.

The tension of metallic films deposited by electrolysis

1909-05-06

G. Stoney

It is well known that metallic films deposited electrolytically are in many cases liable to peel off if deposited to any considerable thickness. This is the case with nickel which, … It is well known that metallic films deposited electrolytically are in many cases liable to peel off if deposited to any considerable thickness. This is the case with nickel which, when deposited over a certain thickness, will curl up into beautiful close rolls, especially if it does not adhere very tightly to the body on which it is deposited. For example, if a piece of glass is silvered by any of the usual silvering solutions, and then nickel is deposited on the silver, it is found that the nickel and silver peel off the glass in close tight rolls almost at once. In ‘Practical Electro-Chemistry,' by Bertram Blount, reference is made on pp. 114 and 272 to the tendency of nickel to peel off, and it is stated that it “will peel—spontaneously and without assignable cause” (p. 272), but that a thick coating can be obtained by keeping the solution at between 50° and 90°C. The late Earl of Rosse tried, about 1865, to make flat mirrors by coating glass with silver chemically, and then electroplating with copper; but he found that, owing to the “contraction” of the copper film, it became detached from the glass. I have had the' same experience in protecting silver 61ms in searchlight reflectors by a film of electro-deposited copper, it being found that if the film of copper is more than 0.01 mm. thick peeling is apt to take place.

Effect of coating time and heat treatment on structures and corrosion characteristics of electroless Ni–P alloy deposits

2003-07-22

Habib Ashassi-Sorkhabi , Saeid Rafizadeh

An overall aspect of electroless Ni-P depositions—A review article

2006-06-01

Keerthana Krishnan , S. John , K.N. Srinivasan +3 more

Electrodeposition of composite coatings containing nanoparticles in a metal deposit

2006-01-27

Chee Tong John Low , R.G.A. Wills , F.C. Walsh

Kinetics of the Deposition of Inert Particles from Electrolytic Baths

1972-01-01

N. Guglielmi

To explain the peculiarities shown by the codeposition of inert particles from electrolytic baths, a mechanism based on two successive adsorption steps is proposed. In the first step the particles … To explain the peculiarities shown by the codeposition of inert particles from electrolytic baths, a mechanism based on two successive adsorption steps is proposed. In the first step the particles are loosely adsorbed, and they are in equilibrium with the particles in suspension. In the second step the particles are irreversibly adsorbed. Making a few elementary hypotheses about the mechanism that governs the two steps it is possible to deduce a general expression relating the concentration of the embedded particles to the suspension concentration and the electrode overpotential. This relationship is verified experimentally.

Electrolytic Dissolution of Binary Alloys Containing a Noble Metal

1967-01-01

H. W. Pickering , C. D. Wagner

In the electrolytic dissolution of binary alloys the concepts of ionization and redeposition of a metal, coupling of the anodic reactions in accordance with the concepts of irreversible thermodynamics, and … In the electrolytic dissolution of binary alloys the concepts of ionization and redeposition of a metal, coupling of the anodic reactions in accordance with the concepts of irreversible thermodynamics, and volume diffusion in the presence of given supersaturations of single and double vacancies are analyzed theoretically. The ionization‐redeposition mechanism is in principle possible but only if coupling of the anodic reactions occurs. Volume diffusion may be operative via divacancies. Results from x‐ray investigations and from measurements with a rotating disk‐ring electrode for copper‐gold alloy indicate that interdiffusion of the constituent metals in the alloy occurs to a significant extent and dissolution of Au does not take place. Electrochemical measurements with a Cu‐Zn alloy involving 30 a/o (atomic per cent) Zn give no indication of occurrence of the ionization‐redeposition mechanism.

Superconformal Electrodeposition of Copper

2001-01-01

Thomas P. Moffat , Daniel Wheeler , William Huber +1 more

A model of superconformal electrodeposition is presented based on a local growth velocity that is proportional to coverage of a catalytic species at the metal/electrolyte interface. The catalyst accumulates at … A model of superconformal electrodeposition is presented based on a local growth velocity that is proportional to coverage of a catalytic species at the metal/electrolyte interface. The catalyst accumulates at the interface through reaction with the electrolyte. More importantly, if the concentration of the catalyst precursor in the electrolyte is dilute, then surface coverage within small features can change far more rapidly due to changing interface area. In such a case, the catalyst effectively floats on the interface during deposition, with changes in coverage coupled to alterations in arc-length of the moving surface. The local coverage therefore increases during conformal growth on a concave surface, resulting in a corresponding increase in the local deposition rate. The opposite is true for a convex surface. The model is supported by experiments and simulations of superconformal copper deposition in 350-100 nm wide features. The model also has significant implications for understanding the influence of adsorbates on the evolution of surface roughness during electrodeposition. © 2001 The Electrochemical Society. All rights reserved.

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Electrodeposition of copper: the nucleation mechanisms

2002-07-01

Darko Grujičić , Batrić Pešić

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Electrodeposition of Copper in the SPS-PEG-Cl Additive System

2004-01-01

Thomas P. Moffat , Daniel Wheeler , D. Josell

The kinetics of copper electrodeposition from an acidified cupric sulfate electrolyte containing SPS-PEG-Cl were examined. Voltammetric and chronoamperometric experiments reveal a competition between poly(ethylene glycol) (PEG) and (SPS) for surface … The kinetics of copper electrodeposition from an acidified cupric sulfate electrolyte containing SPS-PEG-Cl were examined. Voltammetric and chronoamperometric experiments reveal a competition between poly(ethylene glycol) (PEG) and (SPS) for surface sites. PEG interacts synergistically with and to form a passivating film that inhibits the metal deposition rate by two orders of magnitude. Subsequent adsorption of short chain disulfide or thiol molecules with a sulfonate-end group(s) leads to the disruption and/or displacement of the passivating surface complex and acceleration of the metal deposition rate. The effect of submonolayer quantities of catalytic SPS is sustained even after extensive metal deposition, indicating that the catalyst largely remains segregated on the growth surface. Multicycle voltammetry reveals a significant potential dependence for SPS adsorption as well as its subsequent deactivation. Catalyst deactivation, or consumption, was examined by monitoring the quenching of the metal deposition rate occurring on SPS-derivatized electrodes in a SPS-free electrolyte. Catalyst consumption is a higher order process in terms of its coverage dependence and a maximum deactivation rate is observed near an overpotential of −0.1 V. Derivatization experiments are shown to be particularly effective in revealing the influence of molecular functionality in additive electroplating. Specifically, the charged sulfonate end group is shown to be central to effective catalysis. © 2004 The Electrochemical Society. All rights reserved.

Electrodeposition of nanostructured coatings and their characterization—A review

2008-10-18

I. Gurrappa , Leo Binder

Nanostructured materials have gained importance in recent years due to their significantly enhanced properties. In particular, electrochemistry has a special role in producing a variety of nanostructured materials. In the … Nanostructured materials have gained importance in recent years due to their significantly enhanced properties. In particular, electrochemistry has a special role in producing a variety of nanostructured materials. In the current review, we discuss the superiority of electrochemical deposition techniques in synthesizing various nanomaterials that exhibit improved characteristics compared with materials produced by conventional techniques, as well as their classification, synthesis routes, properties and applications. The superior properties of a nanostructured nickel coating produced by electrochemical deposition are outlined. The properties of various nanostructured coating materials produced by electrochemical techniques are also described. Finally, the importance of nanostructured coatings in industrial applications as well as their potential in future technologies is emphasized.

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The Anomalous Codeposition of Iron-Nickel Alloys

1965-01-01

Harald Dahms , Ian M. Croll

The dependence of the anomalous codeposition of iron‐nickel alloys on the pH at the cathode surface is investigated. An equation is derived to evaluate the surface pH as a function … The dependence of the anomalous codeposition of iron‐nickel alloys on the pH at the cathode surface is investigated. An equation is derived to evaluate the surface pH as a function of bulk pH, rate of hydrogen evolution, buffer concentration, and diffusion conditions. The results obtained on rotating disk electrodes show that anomalous codeposition is due to a suppression of nickel discharge and that suppression occurs only when the surface pH is high enough to cause hydroxide formation. A type of mechanism is proposed by which the adsorption of ferrous hydroxide suppresses the deposition of nickel but permits a high rate of iron discharge. Experimental results which support this mechanism are discussed. This type of mechanism could be of general importance for other systems exhibiting anomalous codeposition.

A review of the electrodeposition of metal matrix composite coatings by inclusion of particles in a metal layer: an established and diversifying technology

2014-03-01

Frank C. Walsh , Carlos Ponce de León

Following a brief overview of their history, which dates back to the 1920s with marked developments during the 1960s and 1970s, the principles of composite coatings, achieved by including particles … Following a brief overview of their history, which dates back to the 1920s with marked developments during the 1960s and 1970s, the principles of composite coatings, achieved by including particles dispersed in a bath into a growing electrodeposited metal layer, are considered. The principles and role of electroplating compared to other techniques for realising such coatings, are considered. A good quality particle dispersion (often aided by a suitable type and concentration of surfactants) appropriate choice of work-piece shape/geometry and controlled agitation in the bath are seen to be prerequisites for achieving uniform coatings having a well-dispersed particle content by electroplating. Examples are provided to illustrate the influence of bath composition and plating conditions on deposit properties. Engineering applications of included particle composite layers are illustrated by examples of hard ceramic, soft ceramic and polymer inclusion composite coatings from the recent literature. Current trends in the development of composite plated coatings are summarised and their diverse applications are seen to include the use of finely structured (especially nanostructured) and functionally active particles together with hybrid and more complex, e.g. hierarchical, structures for applications ranging from tribology to speciality electronics, magnetic and electrochemical energy conversion materials.

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Kinetics and Mechanisms of Cu Electrodissolution in Chloride Media

1986-10-01

H. P. Lee , Ken Nobe

Ring‐disk electrode studies of anodic polarization of Cu in acidic chloride solutions indicate four distinct potential regions: the apparent Tafel region, the peak current and current minimum region, the limiting … Ring‐disk electrode studies of anodic polarization of Cu in acidic chloride solutions indicate four distinct potential regions: the apparent Tafel region, the peak current and current minimum region, the limiting current region, and potentials above the limiting current region. Ring currents measured the flux of cuprous and cupric species from the disk. Dependence of disk and ring currents on H+ and Cl− and on rotating rate has been determined. Models are proposed to describe Cu electrodissolution in the apparent Tafel region and the potential region above the limiting currents. The results indicate mixed mass‐transfer and kinetic control with cuprous chloride complex as the limiting diffusion species in the apparent Tafel region. At potentials above the limiting current region, there is simultaneous mass‐transfer control of the cuprous chloride complex and kinetic control of Cu++ formation via the reaction, . Within the peak current and current minimum region and the limiting current region, Cu electrodissolution by mass transport is controlled in accord with previous work.

Preparation of monocrystalline Pt microelectrodes and electrochemical study of the plane surfaces cut in the direction of the {111} and {110} planes

1980-02-01

J. Clavilier , R. Faure , G. Guinet +1 more

Nickel plating on steel by chemical reduction

1946-07-01

Abner Brenner , Grace Riddell

A process has been developed for the production of adherent nickel deposits of good quality on steel without the uSe of an electric current.The deposition of nickel is brought about … A process has been developed for the production of adherent nickel deposits of good quality on steel without the uSe of an electric current.The deposition of nickel is brought about by chemical reduction of a nickel salt with hypophosphites in a hot ammoniacal solution.The reaction is catalytic and, under the prescribed conditions of concentration and pH, no reduction occurs in the solution unless certain metals, such as steel or nickel, are introduced into the bath.The reduction then occurs only at the surface ot the immersed metal with the production of a coating of nickel of 96 to 97 percent purity.Plating by Che:mical Reduction 693841-46-5 Furthermore, the object being plated, which was a tube with an inside anode, was found to have been completely plated on the outside, although no external anodes had been used.Although this process will not replace electrodeposition of nickel, it may prove useful for special applications.

Modern Electroplating

2010-10-04

Electrodeposition of Ni-Fe alloys, composites, and nano coatings–A review

2016-09-09

V. Torabinejad , Mahmood Aliofkhazraei , Sahar Assareh +2 more

Handbook of Semiconductor Electrodeposition

2017-07-12

Pandey

Aiming to bridge the gap in understanding between professional electrochemists and hard-core semiconductor physicists and material scientists, this book examines the science and technology of semiconductor electrode-positioning. Summarizing state-of-the-art information … Aiming to bridge the gap in understanding between professional electrochemists and hard-core semiconductor physicists and material scientists, this book examines the science and technology of semiconductor electrode-positioning. Summarizing state-of-the-art information concerning a wide variety of semiconductors, it reviews fundamental electrodeposition concepts and terminology.

Modern Electroplating

1974-01-01

Frederick A. Lowenheim , Ralph A. Schaefer

Electrodeposition of Alloys

1963-01-01

A Review of Nanostructural Aspects of Metal Electrodeposition

2008-04-01

L. Peraldo Bicelli , Benedetto Bozzini , Claudio Mele +1 more

In this review we address the electrochemical growth of metals and alloys with nanometric structures controlling the functional properties of electrodeposited coatings and freestanding electroforms. Electrodeposition is starting to be … In this review we address the electrochemical growth of metals and alloys with nanometric structures controlling the functional properties of electrodeposited coatings and freestanding electroforms. Electrodeposition is starting to be regarded as a viable process for nanofabrication and - even though electrocrystallisation has received considerable attention from both the theoretical and experimental viewpoints - it is now worth focussing systematically on the role of processing and electrochemical engineering factors, in the tailoring of nanosized structural features. This information is currently scattered in the literature and a specific review would fill an information gap. This paper offers: (i) an overview of the tools currently avaliable for the description and in-situ and ex-situ assessment of the nanostructure of electrodeposited metals; (ii) a systematic discussion of the relationships among their nanostructure and mechanical and chemical properties; (iii) a rationalisation of the mechanisms of formation of the different types of nanoelectrodeposits; (iv) a critical presentation - ordered by chemical composition - of specific systems. An updated and comprehensive literature coverage is provided, based on over 300 papers.

Electroless plating : fundamentals and applications

1990-01-01

Glenn O. Mallory , Juan Hajdu

Electrodeposition of Alloys: PRINCIPLES and PRACTICE

1963-01-01

Abner Brenner

Theory and Practice of Metal Electrodeposition

2011-01-01

Yuliy D. Gamburg , Giovanni Zangari

Integrated Electrochemical and Computational Elucidation of Nitro Blue Tetrazolium Chloride as an Efficient Leveler for Copper Microvia Superfilling

2025-06-19

D. Y. Xing , Xiangfu Wei , J. Ye +3 more | Micromachines

Levelers are indispensable additives for achieving void-free, bottom-up superconformal copper filling of microvias. Establishing the molecular-level correlation between leveler structure and performance is therefore essential to the continued advancement of … Levelers are indispensable additives for achieving void-free, bottom-up superconformal copper filling of microvias. Establishing the molecular-level correlation between leveler structure and performance is therefore essential to the continued advancement of microelectronic copper-plating technology. Herein, nitro blue tetrazolium chloride (NBT) is identified as an efficient leveler for copper microvia superfilling. A multiscale strategy-combining electrochemical measurements, X-ray photoelectron spectroscopy (XPS), density functional theory (DFT) calculations, and molecular dynamics (MD) simulations-is employed to elucidate the action mechanism of NBT and pinpoint its electroactive sites. Electrochemical tests show that NBT markedly suppresses copper deposition and, together with polyethylene glycol (PEG), effectively resists competitive adsorption by bis-(3-sulfopropyl) disulfide (SPS), thereby enhancing the microvia superfilling performance of the PEG-SPS-NBT additive system. DFT results reveal that the nitro groups and tetrazolium rings constitute the primary adsorption centers on the copper surface; the nitro groups additionally strengthen intermolecular interactions between NBT and PEG. MD simulations further confirm that NBT anchors onto the Cu(111) surface predominantly through these NO2 groups and the tetrazolium ring, while co-adsorbed PEG enhances the overall adsorption strength of NBT. The electroplating experiment demonstrates that NBT can act as an effective leveler for microvia superfilling. Moreover, XPS analyses further confirm the synergistic co-adsorption of NBT and PEG and verify that the NO2 groups and tetrazolium rings are the dominant adsorption sites of NBT. Collectively, the electroplating, XPS, electrochemical, DFT, and MD findings clarify the structure-activity relationship of NBT and provide rational guidelines for designing next-generation copper-plating levelers.

Structure and micro-journal bearing working life of electroless Ni–P plating by varying pH value, ultrasonic assistance

2025-06-18

Ruei-Chi Hsu , Hung-Yin Tsai | The International Journal of Advanced Manufacturing Technology

Abstract Ni–P coatings were electroless deposited on brass substrates at various pH levels (ranging from pH 4 to pH 9) with ultrasonic assistance (20 to 40 kHz). The study analyzed … Abstract Ni–P coatings were electroless deposited on brass substrates at various pH levels (ranging from pH 4 to pH 9) with ultrasonic assistance (20 to 40 kHz). The study analyzed the coatings' morphology, microstructure, hardness, corrosion resistance, fatigue life, and the working life of micro-journal bearings. XRD and TEM analyses confirmed that the Ni–P coating had a non-crystalline structure. XPS was employed to study the bonding states and chemical composition of the coating. As the pH increased, the deposition rate rose (film thickness increasing from 0.84 μm to 1.10 μm after 10 min of plating), and the phosphorus content decreases, indicating that the Ni–P coating became denser, thereby improving surface morphology and mechanical properties. Ultrasound-assisted electroless plating enhanced ion movement and mass transfer effects, resulting in a denser coating and improved the coating film's surface properties. The coating's mechanical features, wear, and corrosion resistance were enhanced. The hardness, corrosion potential, and fatigue life increased from 6.25 to 8.43 GPa, –0.524 to –0.250 V SCE , and 111.3 to 130.5 cycles, respectively. Additionally, the wear rate and micro-journal bearing wear decreased from 1.88 × 10⁻⁶ to 1.50 × 10⁻⁶ g/m and from 1.53 to 0.95 mg, respectively.

The electrodeposition of particle-metal matrix composite coatings to meet tribological and corrosion challenges

2025-06-17

Mir Saman Safavi , F.C. Walsh | Advances in Colloid and Interface Science

In-operando visualization of the dynamic microvia copper filling process for metal interconnection of integrated circuit

2025-06-16

Jiaqiang Yang , Tao Song , Zhao‐Yun Wang +7 more | Electrochimica Acta

Review on Magneto‐Electrodeposition: Tailoring Material Properties for Enhanced Functionalities and Applications

2025-06-16

J. ABRAHAM , N. Rajasekaran | MetalMat

ABSTRACT The most recent advances in electrodeposition methods utilizing magnetic fields show notable enhancements in material properties and its functionality. The way in which magnetic fields affect electrodeposition encompasses several … ABSTRACT The most recent advances in electrodeposition methods utilizing magnetic fields show notable enhancements in material properties and its functionality. The way in which magnetic fields affect electrodeposition encompasses several important elements, such as improved mass transfer, modifications in coating micro, and crystal structures etc. The primary driven factor for these effects is the magnetohydrodynamic (MHD) effect which is induced by the Lorentz force along with the magnetization effect. Current reviews which cover variety of coatings prepared using magneto‐electrodeposition, such as metal, alloy and composite coatings are discussed. This technique finds extensive enhancement in various application domains, including corrosion resistance, electrocatalysis, energy storage, and surface chirality. The capabilities of magneto‐electrodeposition (MED) to control surface structures and electron orientations have created new opportunities for the advancement of sophisticated functional materials with tailored properties for particular applications are discussed in this review.

Localized Electrochemical Deposition 3D Copper–Nickel Core‐Shell Structures at Meso‐Scale

2025-06-15

Yan Huo , Wanfei Ren , Jinkai Xu +3 more | Advanced Engineering Materials

Localized electrochemical deposition (LECD) is a novel technique for the fabrication of metal microstructures, which enables the precise deposition of metal structures at designated locations. Currently, copper constitutes the majority … Localized electrochemical deposition (LECD) is a novel technique for the fabrication of metal microstructures, which enables the precise deposition of metal structures at designated locations. Currently, copper constitutes the majority of deposited metal microstructures owing to its high electrical conductivity, low cost, and favorable fatigue resistance. However, copper exhibits several drawbacks such as susceptibility to oxidation, poor corrosion resistance, low hardness, and inadequate mechanical strength. To overcome these limitations, a copper–nickel core‐shell reinforcement structure is developed, resulting in a significant enhancement of the mechanical properties of the original metal structure. Copper core structures are fabricated using the LECD method, and the effects of deposition potential and electrolyte concentration on the deposition rate are examined. The influence of deposition potential and deposition time on the formation of the nickel shell layer is determined, and the deposited nickel shell layer significantly reduces the defects generated during the deposition of the copper core structure. After conformal deposition, the Cu–Ni core‐shell structure significantly enhances the mechanical properties of the copper. Compared with the pure copper structure, the mechanical properties are improved by 124%, indicating a significant strengthening effect, while the adaptability to actual environments has also been enhanced. This enhancement broadens the potential applications in areas such as electronics, energy, environmental science, and catalysis.

The influence of heat treatment process on electroplated metallized through glass vias (TGV) substrates

2025-06-14

Miao Wang , Jihua Zhang , Libin Gao +7 more | Journal of Alloys and Compounds

Effect of SiC nanoparticles on the wear and corrosion resistance of Ag-Si composite coatings prepared by electrodeposition technique

2025-06-14

F. Bakhtiarifard , Nasim Nayebpashaee | Applied Surface Science Advances

Electroplating Composite Coatings of Nickel with Dispersed WO3 and MoO3 on Al Substrate to Increase Wear Resistance

2025-06-13

P.A. Osipov , Р. А. Шаяхметова , Danatbek Murzalinov +5 more | Materials

Investigations of the synthesis of multicomponent coatings and their subsequent application to metal substrates to increase the wear resistance of materials is relevant for industry. Nickel compounds obtained from oxidized … Investigations of the synthesis of multicomponent coatings and their subsequent application to metal substrates to increase the wear resistance of materials is relevant for industry. Nickel compounds obtained from oxidized magnesia-iron nickel ores with a desorption rate of more than 94% were used to create Ni-MoO3-WO3 electroplating. Such composite samples formed from an aqueous alcohol solution reduced the content of sodium and ammonium chlorides. The annealing and dehydration of samples at a temperature of 725 °C in an air atmosphere made it possible to achieve the highest level of crystallinity. In this case, an isomorphic substitution of W atoms by Mo occurs, which is confirmed by electron paramagnetic resonance (EPR) spectroscopy studies. The invariance of the shape of the EPR spectrum with a sequential increase in microwave radiation power revealed the stability of the bonds between the particles. The surface morphology of Ni-MoO3-WO3 films deposited on an Al substrate is smooth and has low roughness. In this case, an increased degree of wear resistance has been achieved. Thus, a recipe for the formation of an electroplating with stable bonds between the components and increased wear resistance was obtained.

Optimization and Experimental Analysis of Electroless Nickel Plating on the Diamond Surface

2025-06-13

Qingming Fan , Guokang Su , Congmin Zhu +5 more | Micromachines

Coating diamond particle surfaces with a layer of high-temperature resistant nickel, which possesses weldability, effectively enhances the bonding strength between diamond particles and substrates in pre-grinding tools. This improves their … Coating diamond particle surfaces with a layer of high-temperature resistant nickel, which possesses weldability, effectively enhances the bonding strength between diamond particles and substrates in pre-grinding tools. This improves their stability and strength at high temperatures, thereby enhancing the performance, lifespan, and efficiency of grinding tools. This paper explores the electroless nickel plating process on diamond surfaces, analyzes the working principle of electroless nickel plating on diamond surfaces, and proposes the use of 2 g/L AgNO3 solution and 2 g/L AgNO3 + 10 mL/L NH3·H2O solution as Pd-free activating solutions. Experimental studies have demonstrated the feasibility of using silver nitrate as an activator, and it has been found that the 2 g/L AgNO3 + 10 mL/L NH3·H2O solution achieves a higher surface plating ratio when used as an activator for electroless nickel plating on diamond surfaces. Based on this, through orthogonal and single-factor experimental methods, the effects of ammonia solution concentration, sodium hypophosphite concentration, plating temperature, and diamond particle size on electroless nickel plating on diamond surfaces were investigated. The optimal process for electroless nickel plating on diamond surfaces was obtained: ammonia solution concentration of 17.5 mL/L, sodium hypophosphite concentration of 33 g/L, and plating temperature of 80 °C. Under this process, using diamond particles with a size of 120/140 for electroless nickel plating, a surface plating ratio of 10.75% electroless nickel-plated diamond can be achieved.

A review on electrodeposition and tribological performance of chromium-based coatings from eco-friendly trivalent chromium baths

2025-06-10

V. S. Protsenko | Discover Electrochemistry.

Effect of Vacuum and Air Heat Treatments on the Properties of the Electroless Ni−P Coating on Magnesium Alloy

2025-06-04

Sizhen Li , Jinhua Yu , Yan Zheng +7 more | Materials Research Express

Abstract Electroless Ni−P coatings on magnesium alloy specimens were heat-treated in vacuum and air atmospheres at 200 °C, 250 °C, and 300 °C. The results showed that the coating grains … Abstract Electroless Ni−P coatings on magnesium alloy specimens were heat-treated in vacuum and air atmospheres at 200 °C, 250 °C, and 300 °C. The results showed that the coating grains evolved into fine nodular structures following heat treatment at 200 °C and above. Nodule sizes ranged from 0.40 μm to 2.4 μm, with higher heat treatment temperatures significantly raising the proportion of larger nodules (nodule length: L ≥ 1 μm). Under identical heat treatment conditions, the average nodule size was smaller in vacuum compared to air. With increasing heat treatment temperature, the coating gradually transformed from microcrystalline to a crystalline structure, with vacuum heat treatment yielding a higher degree of crystallization than treatment in air. Meanwhile, a distinct Ni3P phase was observed in the coating after vacuum heat treatment at 300 °C. For vacuum heat treatment at 200 °C and above, as well as air heat treatment at 200 °C, nickel and phosphorus on the coating surface mainly existed in their elemental forms, with minor amounts of Ni(OH)2 and phosphate compounds present. Following air heat treatment at 250 ℃ and above, nickel and phosphorus on the surface were completely oxidized. Heat treatment increased the φcorr of the coating from approximately −0.45 V to above −0.3 V, while the Jcorr decreased by an order of magnitude. Furthermore, the coating hardness increased from 406 HV to 529.1 HV and 499.2 HV after vacuum and air heat treatments at 300 °C, respectively. Air heat treatment caused agglomeration of the tin solder on the coating surface, resulting in reduced weldability compared to vacuum treatment. Vacuum heat treatment promoted coating crystallization, leading to a notable increase in hardness. Additionally, the absence of surface oxidation under vacuum conditions enhanced welding performance.

Characterization and corrosion analysis of zinc coating by electrodeposition using acid chloride electrolyte solution.

2025-06-01

Umer Draz , Muhammad Waseem , Tanveer Iqbal | Results in Surfaces and Interfaces

Improving mechanical properties and corrosion resistance of Zn-Ni-Co ternary alloy coatings by exploring the optimum anomalous co-deposition process

2025-06-01

Yunhu Ding , Ying He , Zixuan Xu +3 more | Journal of Alloys and Compounds

Multiphysics simulation and experimental study on uniformity of jet electrodeposited bronze coating in deep small hole

2025-06-01

Ya Chen , Haozhe Pang , Jinsun Liao +6 more | Electrochimica Acta

Enhancing the Electrochemical Properties of Metal Deposits in Autocatalytic Copper Deposition Baths Containing Polyols

2025-06-01

Suseela Jayalakshmi , Raja Venkatesan , Palanivelu Balaramesh +3 more | ChemistrySelect

Abstract This paper reveals the impact of pH and the number of hydroxide groups in an environmentally friendly copper deposition bath using polyhydroxylic chelators using dimethylamine borane (DMAB) as a … Abstract This paper reveals the impact of pH and the number of hydroxide groups in an environmentally friendly copper deposition bath using polyhydroxylic chelators using dimethylamine borane (DMAB) as a reductant and potassium hydroxide as a pH adjuster at room temperature (28 ± 2 °C). Glycerol, erythritol, xylitol, and sorbitol are examples of monosaccharide polyols having tri, tetra, penta, and hexa hydroxylic groups in their structures were used as an environmentally benign complexing agent in the methane sulphonic acid (MSA) solvated deposition bath. The study demonstrated that, in addition to the hydroxide groups in the polyols, the pH of the electroless bath is a critical factor in copper deposition. The impact of temperature and pH on the rate of deposition of the bath was examined. Atomic absorption spectroscopy and X‐ray diffraction studies was used to examine the surface and structural properties of the deposits and Tafel, electrochemical impedance, and cyclic voltammetry (CV) were used to examine the electrochemical properties of the polyol chelated deposition bath.

Effect of Co-deposition of TiO2 and SiC Nanoparticles on Micro-hardness, Wear and Corrosion Behavior of Electrodeposited Ni-W Based Nanocomposite Coating

2025-06-01

S. Taheri , Bijan Abbasi Khazaei , A.M. Rashidi +2 more | Materials Chemistry and Physics

Exploration of poly(1,4-butanediol diglycidyl ether, 2-methylimidazole, and imidazole) as leveling agents in blind hole copper plating

2025-06-01

Xiangjian Zeng , Z.Q. Pan , Guanghui Hu +4 more | Journal of Materials Science Materials in Electronics

Electrochemical deposition of Ni–P-V2CTX nanocomposite coatings on copper surfaces and their anti-corrosion properties

2025-05-30

Pengju Shi , Xianfeng Zhao , Xinxin Shao +5 more | Ionics

An examination of the wear characteristics of nickel-pulse plated composite coatings utilising a rotating cathode electrode with varying morphologies: experimental and molecular dynamics simulation approaches

2025-05-29

Ali Hadipour , Hamid Daneshmand | Canadian Metallurgical Quarterly

Influence Of Silica Content into Nickel/Silica Electrodeposited Composite Coating for Mechanical and Corrosion Resistant Properties Enhancement: A Review

2025-05-29

Koutouan Désiré Martial Abro , Adjoavi Colette Djassou , Yao Joseph Adjoumani +1 more | Indo J Chem Res

The ratio cost/efficiency of electrodeposited composite coating has boosted the development of this method in the last decades. Thus, electrodeposited nickel with silica particles as reinforcement was successfully designed and … The ratio cost/efficiency of electrodeposited composite coating has boosted the development of this method in the last decades. Thus, electrodeposited nickel with silica particles as reinforcement was successfully designed and the conditions to increase particles in the composite are better understood. Those composites' morphological, mechanical, and corrosion properties as a function of the embedded silica particles were also investigated. In this review, the last findings about nickel/silica preparations and their properties are specifically summarized. Data collected here indicate that silica particles entrapment depends on current density, particle load in the bath, particle surface modification, and hydrodynamics. The presence of silica particles in the composite led to the refinement of the nickel grain and consequently enhanced the mechanical and corrosion properties.

Surfactant-enhanced oxygen bubble detachment on lead anodes during metal electrowinning

2025-05-29

Yuanliang Yuan , Yitao Liu , Xiaocong Zhong +2 more | International Journal of Hydrogen Energy

Main Effects of Additives on Copper Electroplating at High Current Density

2025-05-27

Tae‐Gyu Woo , Il‐Song Park | Korean Journal of Materials Research

Preparation and mechanical properties of Ni–P–Al2O3–SiO2 composite coatings by pulsed electrodeposition

2025-05-26

Lianyong Xu , Yongfeng Li , Long Zheng

Evaluation of Adhesion Properties of Electrodeposited Copper Thin Films: Theoretical and Experimental Approach

2025-05-25

Ivana Mladenović , Jelena S. Lamovec , Dana Vasiljević-Radović +3 more

The adhesion of copper thin films galvanostatically electrodeposited on Cu cathodes from electrolytes without or with the addition of various additives, such as chloride ions, polyethylene glycol 6000 (PEG 6000), … The adhesion of copper thin films galvanostatically electrodeposited on Cu cathodes from electrolytes without or with the addition of various additives, such as chloride ions, polyethylene glycol 6000 (PEG 6000), and 3–mercapto–1–propanesulfonic acid, has been investigated. Morphological and structural analyses of synthesized films were performed using the SEM, AFM, and XRD methods, while the adhesion of the films was examined by applying the theoretical Chen–Gao (C–G) composite hardness model using results from Vickers microindentation, a bidirectional bending test, and a scratch-tape adhesion test. The morphologies of the films were either very smooth, with mirror-like brightness, obtained from the electrolyte containing all three additives, or microcrystalline, with different grain sizes, obtained from other electrolytes. The best adhesion was observed in the fine-grained film with numerous boundaries among grains, obtained with the addition of chloride ions and PEG 6000, while the mirror-bright film obtained with a combination of all three additives showed the worst adhesion. The boundaries among grains represented barriers that decreased the depth of penetration during microindentation and, consequently, increased the hardness and enhanced the adhesion of the film. The size of the grains—and hence, the number of grain boundaries—was regulated by the composition of the electrolytes achieved by the addition of additives. Good agreement was observed among the various methods used for the estimation of the adhesion properties of Cu films.

Electrochemical Properties of Copper Electroplating with Supercritical Carbon Dioxide Emulsion

2025-05-24

Kazuhito Higuchi , Tso‐Fu Mark Chang , Masato Sone

Effects of Rotating Speed of Rotating Cylinder Electrode and Bath Composition on Fe–Ni Alloy Electroplating

2025-05-23

Nayoung Kang , Jae-Ho Lee

Selective C2 Electroproduction via Back Bonding in Asymmetric Copper‐Copper Motifs

2025-05-20

Junwu Zhu , Chenchen Fang , Liming Dai +7 more

CO2 reduction reaction (CO2RR) is considered a highly attractive approach to reduce carbon emission and yet encounters challenges in further converting *C1 intermediates to valuable two‐carbon (C2) products. Although copper‐based … CO2 reduction reaction (CO2RR) is considered a highly attractive approach to reduce carbon emission and yet encounters challenges in further converting *C1 intermediates to valuable two‐carbon (C2) products. Although copper‐based catalysts exhibit satisfactory adsorption energy for *C1 species, the symmetrical charge distribution at adjacent copper sites leads to a strong repulsive force between adsorbed *C1. Herein, asymmetric copper‐copper (CuF‐CuN) motifs with distinct adsorption behaviors have been constructed on the F‐Cu3N substrate using the in situ isostructural substitution method. Compared to the high hybridization of CuN 3d and N 2p orbitals, implanted F not only reduces the hybridization strength but also endows the CuF with delocalized unpaired electrons. Accordingly, CuF, beyond forming an isolated 3dz2‐2pz σ bond between Cu and the key *C1 intermediate (*CHO), offers additional 3dxz‐2pz π back bonding to the *CHO. With dipole interactions in the asymmetric CuF‐CuN motifs, the electrostatic repulsion between adjacent *CHO is diminished, efficiently promoting the C‐C coupling in CO2RR. Therefore, the CuF‐CuN motifs achieve an exceptional C2 selectivity of 81.5% with a partial current density of −325.9 mA cm−2 and a C2/C1 selectivity ratio of 10.47. This nuanced manipulation of atomic interactions illuminates a path to potentially groundbreaking alterations in material characteristics.

Research on the Effects of Environmentally Friendly Additives on Mild Steel Electroless Plating

2025-05-18

M. Senthil Kumar , Rajagopal Desikan , S. Karthikeyan

Tween Compounds as Eco-Friendly Suppressors for Acid Copper Electroplating Applications of Microvia

2025-05-17

Zewei Lin , Zhihua Tao , Yuxuan Huang +1 more

Pulsed electro deposition of Zinc, Molybdenum and Graphene (ZnMoG) Nanocomposite Coatings

2025-05-17

N. R. Karthik , J. Yoganandh , Rajasingh Raveen

Effect of TiC Addition on Microstructure and Performances of Double Pulse Electrodeposited Ni-TiC Coatings

2025-05-17

Haijun Liu , Hui Wang , Fafeng Xia

Nickel–titanium carbide (Ni-TiC) coatings were synthesized on Q235 steel via double-pulse electrodeposition to enhance surface properties. The influence of TiC concentration on surface morphology, microstructure, and performance was systematically studied … Nickel–titanium carbide (Ni-TiC) coatings were synthesized on Q235 steel via double-pulse electrodeposition to enhance surface properties. The influence of TiC concentration on surface morphology, microstructure, and performance was systematically studied using SEM, TEM, XRD, microhardness testing, wear analysis, and electrochemical methods. At low TiC concentrations (2–4 g/L), the coatings exhibited typical cell-like morphology. At 8 g/L, the coating showed a dense structure, refined grains, and broad Ni diffraction peaks. TEM analysis revealed nickel and TiC grain sizes of 97.82 nm and 34.75 nm, respectively. The plating rate remained stable (~36.94 mg·cm−2·h−1), while surface roughness increased with TiC content. The 8 g/L TiC coating achieved the highest microhardness (743.13 HV), lowest wear loss (5.43%), and superior corrosion resistance, with a self-corrosion current density of 5.27 × 10−6 A·cm−2 and polarization resistance of 7705.62 Ω·cm2. These enhancements are attributed to uniform TiC dispersion and grain boundary pinning. Thus, 8 g/L TiC is optimal for fabricating Ni-TiC coatings with improved mechanical and electrochemical performance. This work demonstrates a practical strategy for developing high-performance Ni-based composite coatings via double-pulse electrodeposition.

New Insights into Pd-Ni Alloy Nucleation and Growth during Electrodeposition from a Reline DES

2025-05-15

Midori Landa-Castro , Manuel Palomar‐Pardavé , M. Romero‐Romo +5 more

Abstract This work pioneers results of Pd-Ni alloy nanoparticles (NPs) formation onto a glassy carbon electrode (GCE), from reline deep eutectic solvent, by means of potentiostatic electrodeposition. The experimental current … Abstract This work pioneers results of Pd-Ni alloy nanoparticles (NPs) formation onto a glassy carbon electrode (GCE), from reline deep eutectic solvent, by means of potentiostatic electrodeposition. The experimental current density transients obtained at different applied potentials were analyzed with the theoretical model developed for electrochemical nucleation and growth of bimetallic phases, modified because of the contribution due to reduction of the residual water onto the Pd-Ni NPs growing surfaces. From this analysis it was possible to deconvolute the contributions due to Pd-Ni NPs formation (the first electrochemical reaction, E1) and residual water reduction (the second electrochemical reaction, E2). This conjoint reaction leads to formation of hydroxide ions, OH–, which chemically interact with the metallic ions in solution, producing the respective insoluble hydroxides (chemical reaction, C); thus, formation of Pd-Ni NPs in this system occurs via an E1E2C mechanism. The surface of the GCE modified with Pd-Ni NPs (GCE/Pd-Ni NPs) was analyzed with X-ray diffraction, X-ray photoelectron spectroscopy, scanning electron microscopy, and energy-dispersive spectroscopy techniques that confirmed formation of nanostructured sphere-like aggregates, with diameters dependent on time and applied potential. Moreover, it was possible to prove the presence of the Pd-Ni alloy.

Electrocapillary‐Driven Metal Expulsion in Post‐Transition Metal‐Based Liquid Alloys

2025-05-15

Xichao Zhang , Yuxiang Wang , Fahimeh Gholampoursaadi +4 more

Abstract Alloying is a spontaneous process governed by the intrinsic miscibility of metal atoms. The reverse process of dealloying miscible metals through direct physical means is challenging to achieve. Here, … Abstract Alloying is a spontaneous process governed by the intrinsic miscibility of metal atoms. The reverse process of dealloying miscible metals through direct physical means is challenging to achieve. Here, a novel physical process is reported for the direct separation of solute metals from liquid alloys. The findings show that electrocapillary in Ga─Sn─Bi─Pb liquid alloy can lead to the selective expulsion of Bi, Sn, or Pb from the alloy surface as pure metals. The metals are expelled sequentially from the alloy with Bi first, followed by Sn, and then Pb. Theoretical calculations suggest that the sequence of expulsion is primarily determined by the surface energy of solute metals. A metallurgical process based on this phenomenon is proposed and evaluated as a viable approach for refining post‐transition metals. This study presents innovative insights that lay the foundation for developing reliable low‐energy metallurgical techniques to separate metals based on differences in their surface energy.

Effect of Heat Treatment on the Microstructure and Corrosion Properties of Electroless Ni-P Coating on AISI 1010 Steel in a Simulated Seawater

2025-05-15

Rahayu Kusumastuti , Arya Fahriansyah , Siti Musabikha +7 more

Abstract The effect of heat treatment on surface topography and corrosion behavior of an electroless nanocrystalline Ni-P coating on AISI 1010 low-carbon steel was investigated. Detailed characterizations using secondary electron … Abstract The effect of heat treatment on surface topography and corrosion behavior of an electroless nanocrystalline Ni-P coating on AISI 1010 low-carbon steel was investigated. Detailed characterizations using secondary electron microscopy-energy dispersive X-ray spectroscopy (SEM-EDX), atomic force microscopy (AFM), and X-ray diffractometry (XRD) were employed to examine the coating morphology and microstructure. Potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) were applied to examine the corrosion behavior of the Ni-P coating in simulated seawater. Results demonstrate that heat treatment at 300°C (HT–300) significantly improved corrosion resistance, reducing the corrosion rate from 142.10±2 mmpy in the non-heat-treated coating to 22.26±0.72 mmpy. The coating heat-treated at 300°C promotes the crystallization of the deposited Ni-P layer with the formation of Ni 3 P phase, which acts as a protective barrier against corrosion. The formation of the intermetallic Ni 3 P phase upon heat treatment also enhances the hardness of the Ni-P coating as high as 978.3+4.5 HV. Heat treatment at 500°C results in the formation of Fe 3 O 4 and Fe 2 O 3 phases, indicating that the optimal HT temperature has been exceeded. EIS analysis confirmed enhanced coating stability due to increased charge transfer resistance, while X-ray photoelectron spectroscopy (XPS) identified NiO, Ni(OH) 2 , Fe 3 O 4 , and Ni 3 P phases as corrosion products. These findings highlight the effectiveness of heat treatment in enhancing the protective properties of Ni-P coatings for marine applications.